Title:
ALKALINE-WATER-SOLUBLE HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JPH06184507
Kind Code:
A
Abstract:
PURPOSE: To provide a hot-melt adhesive which is sol. in alkaline. water and excellent in water resistance and adhesive power by incorporating a terpolymer comprising three kinds of specific structural units in a specified molar ratio into the adhesive.
CONSTITUTION: This adhesive contains a terpolymer comprising structural units of formulae I, II, and III in a molar ratio of I:II:III of 1:(0.5-1.5):(0.2-5).
Inventors:
KAWAME TOSHIMITSU
NOBUTO YOSHIKI
OISHI ATSUSHI
NOBUTO YOSHIKI
OISHI ATSUSHI
Application Number:
JP10037292A
Publication Date:
July 05, 1994
Filing Date:
March 26, 1992
Export Citation:
Assignee:
KURARAY CO
International Classes:
C09J123/22; C09J123/18; C09J133/04; C09J133/08; (IPC1-7): C09J123/22; C09J133/08
Previous Patent: Polymer vehicles glass which has an embedding type opaque edge belt
Next Patent: EVALUATING DEVICE FOR FILM QUALITY OF INSULATION FILM
Next Patent: EVALUATING DEVICE FOR FILM QUALITY OF INSULATION FILM