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Patent Searching and Data


Title:
アルケニル芳香族系樹脂
Document Type and Number:
Japanese Patent JP5694041
Kind Code:
B2
Abstract:
Provided is an alkenyl aromatic resin which can be used as a hot-melt adhesive agent, has excellent compatibility with a polyethylene resin, and does not undergo the discoloration into yellow or the like. The alkenyl aromatic resin is produced by copolymerizing a mixture comprising the components (A1), (A2) and (A3) mentioned below at -78 to 50ºC with a Friedel-Crafts catalyst, and has a weight average molecular weight of 500 to 1650 in terms of polystyrene. (A1) An alkenyl aromatic compound which has a boiling point ranging from 140 to 180ºC and does not contain indene, and/or at least one aromatic compound which is selected from styrene, a-methylstyrene, vinyltoluene and isopropenyltoluene: 50 to 80 mass%. (A2) A turpentine oil which has a diene value ranging from 15 to 60 (cg/g): 20 to 50 mass%. (A3) A phenol compound: 1 to 15 parts by weight relative to 100 parts by weight of the sum total of the components (A1) and (A2).

Inventors:
Fuyuki Aida
Kim Jong Chul
Application Number:
JP2011098040A
Publication Date:
April 01, 2015
Filing Date:
April 26, 2011
Export Citation:
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Assignee:
jx Nikko Nisseki Energy Co., Ltd.
International Classes:
C08L57/02; C08F2/44; C08F4/14; C08F240/00; C08L23/08; C08L91/06; C09J123/08; C09J157/02; C09J191/06
Domestic Patent References:
JP55065248A
JP9316294A
JP2002069408A
JP64033112A
JP2001059078A
Foreign References:
WO2002014392A1
Attorney, Agent or Firm:
Junyuki Morita