Title:
液相拡散接合用合金
Document Type and Number:
Japanese Patent JP5008969
Kind Code:
B2
Abstract:
An alloy having a low melting point for liquid-phase diffusion bonding capable of bonding both Ni-based heat resistance alloy material and Fe-based steel material. The alloy comprises in atom percent (%): 22
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Inventors:
Hiroaki Sakamoto
Yuichi Sato
Yasushi Hasegawa
Mizuhara Yoji
Yuichi Sato
Yasushi Hasegawa
Mizuhara Yoji
Application Number:
JP2006348064A
Publication Date:
August 22, 2012
Filing Date:
December 25, 2006
Export Citation:
Assignee:
Nippon Steel Corporation
International Classes:
B23K35/30; B23K20/00; C22C19/03; C22C19/05; C22C45/02; C22C45/04; B23K103/04; B23K103/08
Domestic Patent References:
| JP5043773B2 | ||||
| JP60067647A | ||||
| JP6038997B2 |
Foreign References:
| US4410604 | ||||
| EP0127894A1 | ||||
| GB1572284A |
Attorney, Agent or Firm:
Nobuyuki Hayashi
Yasuhiko
Yasuhiko