Title:
アルミニウム−ダイヤモンド系複合体及びこれを用いた放熱部品
Document Type and Number:
Japanese Patent JP6621736
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide an aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. Provided is an aluminum-diamond composite comprising 65-80 vol% of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 µm, and a second peak lies at 55-195 µm, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 µm and the area of the volumetric distribution of grain sizes of 45-205 µm is from 1 : 9 to 4 : 6; the balance being composed of a metal containing aluminum.
Inventors:
Yosuke Ishihara
Takeshi Miyagawa
Hideo Tsukamoto
Shinya Narita
Takeshi Miyagawa
Hideo Tsukamoto
Shinya Narita
Application Number:
JP2016515193A
Publication Date:
December 18, 2019
Filing Date:
April 23, 2015
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
C22C26/00; B22D19/00; C22C1/10; H01L23/36
Domestic Patent References:
| JP2002003831A | ||||
| JP2012158817A | ||||
| JP2007247058A | ||||
| JP2002003830A |
Foreign References:
| WO2013015158A1 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation