Title:
ALUMINUM-DIAMOND COMPOSITE, AND METHOD FOR PRODUCTION THEREOF
Document Type and Number:
Japanese Patent JP2012158783
Kind Code:
A
Abstract:
To provide an aluminum-diamond composite which has high heat conductivity and thermal expansion coefficient close to that of a semiconductor device in combination, and whose surface roughness is improved so as to be suitable for being used as the heatsink of the semiconductor device or the like.
The tabular aluminum-diamond composite 1 comprising diamond particles and a metal including aluminum as a main component comprises a complexed part 2 and the surface layers 3 provided on both faces of the complexed part. The surface layer 3 comprises a diamond-like carbon material having thickness of 0.3-50 μm, and the content of the diamond particles is 40-70 vol.% of the whole aluminum-diamond composite.
Inventors:
HIROTSURU HIDEKI
TSUKAMOTO HIDEO
ISHIHARA YOSUKE
TSUKAMOTO HIDEO
ISHIHARA YOSUKE
Application Number:
JP2011017554A
Publication Date:
August 23, 2012
Filing Date:
January 31, 2011
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C22C26/00; B22C3/00; B22D18/02; B22D19/00; C22C1/10; C23C28/00
Domestic Patent References:
| JP2008532264A | 2008-08-14 | |||
| JP2010029919A | 2010-02-12 | |||
| JP2012117085A | 2012-06-21 | |||
| JP2004104074A | 2004-04-02 | |||
| JP2009283559A | 2009-12-03 | |||
| JP2003188323A | 2003-07-04 | |||
| JP2007327081A | 2007-12-20 |
Foreign References:
| WO2010007974A1 | 2010-01-21 | |||
| WO2010007922A1 | 2010-01-21 | |||
| WO2010007974A1 | 2010-01-21 |
Attorney, Agent or Firm:
Kobayashi Yoshinori
Sonoda Yoshitaka
Sonoda Yoshitaka