Title:
ALUMINUM NITRIDE BOARD AND CIRCUIT BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2001097779
Kind Code:
A
Abstract:
To provide an aluminum nitride board improved in joining strength between the board and a metallic circuit put thereon, in production yield and in joining reliability with a circuit board, and also to provide the circuit board using the subject board.
This board is composed of aluminum nitride(AlN) in which the liquid phase containing at least one component selected from the group consisting of YAG, YAL and YAM, wherein the YAG, YAL and YAM has an X-ray electron spectroscopic peak height of 20% or less, 15% or less and 6% or less, respectively, based on the maximum peak height of the aluminum nitride.
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Inventors:
IYOGI YASUSHI
KOMORIDA YUTAKA
OKAMOTO MITSUHIRO
KOMORIDA YUTAKA
OKAMOTO MITSUHIRO
Application Number:
JP27481899A
Publication Date:
April 10, 2001
Filing Date:
September 28, 1999
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H05K1/03; C04B35/581; H05K3/38; (IPC1-7): C04B35/581; H05K1/03; H05K3/38
Attorney, Agent or Firm:
Hisano Hatano (1 person outside)
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