ALUMINUM NITRIDE CIRCUIT BOARD AND MANUFACTURE THEREOF

Title:

ALUMINUM NITRIDE CIRCUIT BOARD AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JPH06125153

Kind Code:

A

Abstract:

PURPOSE: To provide a mechanically strong aluminum nitride printed circuit board in which the adhesion between an aluminum nitride ceramic and conductors is sufficiently strong and conductors are prevented from breaking.

CONSTITUTION: Wiring conductors, such as planar wirings and vias, are formed on an aluminum nitride green sheet by using copper paste, which is composed mainly of copper and an additive containing a group IVa element or its compound. The green sheet is integrally covered with another green sheet to protect the exposed wirings. This structure is sintered under predetermined conditions, and the resulting sinter is ground and polished to remove its outer surfaces.

Inventors:

HORIUCHI MICHIO
HARAYAMA YOICHI
HAYASHI KOICHIRO

Application Number:

JP29919292A

Publication Date:

May 06, 1994

Filing Date:

October 12, 1992

Export Citation:

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Assignee:

SHINKO ELECTRIC IND CO

International Classes:

C04B35/581; C04B35/58; C04B35/64; C22C29/16; H01L23/14; H05K1/03; H05K1/09; H05K3/38; H05K3/46; (IPC1-7): H05K1/03; C04B35/58; C04B35/64; C22C29/16; H01L23/14; H05K3/38; H05K3/46

Attorney, Agent or Firm:

Takao Watanuki (1 outside)

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