Title:
ALUMINUM NITRIDE SUBSTRATE HAVING METALLIZED LAYER AND THE METALLIZING METHOD THEREOF
Document Type and Number:
Japanese Patent JPH05226515
Kind Code:
A
Abstract:
PURPOSE: To form a metallized layer on an aluminum substrate at lower electric resistance than that of conventional method at low temperature having sufficient bonding strength.
CONSTITUTION: The title aluminum nitride sintered substrate is coated with a paste containing Ag-Cu alloy as the main component and a titanium hydride as the sub component. At this time, it is preferable that 1-50wt% of titanium hydride is contained in the paste while the particle diameter of Ag-Cu alloy and titanium hydride is specified to be 1-50μm furthermore, a metallic surface film may be formed on the metallized layer.
Inventors:
MURA NAOMI
NAKANO TADASHI
KUMAGAI MASATO
NAKANO TADASHI
KUMAGAI MASATO
Application Number:
JP2819492A
Publication Date:
September 03, 1993
Filing Date:
February 14, 1992
Export Citation:
Assignee:
KAWASAKI STEEL CO
International Classes:
C04B35/581; C04B35/58; C04B41/88; C04B41/90; H01L23/15; H05K1/09; H05K3/24; (IPC1-7): C04B35/58; C04B41/88; C04B41/90; H01L23/15; H05K1/09; H05K3/24
Attorney, Agent or Firm:
Yoshio Kosugi (1 person outside)