Title:
ALUMINUM RIBBON AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2015037111
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a low-cost Al ribbon for bonding use which is to be used for bonding a semiconductor device to a substrate, has high connection strength, is hard to cause a crack or the like, enables the stable bonding and especially, makes possible to meet the strong demand for cost reduction.SOLUTION: An Al ribbon for bonding use is produced by drawing an Al alloy including Al as a primary component in one stage and subsequently, rolling it into a ribbon-like form. The Al ribbon comprises a total 800 ppm or less of at least one of Ni, Si and P with the balance consisting of Al and inevitable impurities. The Al ribbon has an average crystal grain diameter of 2-250 μm and surface roughness Ra of 2.5 μm or less. The Al ribbon has an oxide film, of which the thickness is 5 nm or less.
Inventors:
IZEKI TAKASHI
NAKADA TETSUSHI
MURASE EIJI
NAKADA TETSUSHI
MURASE EIJI
Application Number:
JP2013168051A
Publication Date:
February 23, 2015
Filing Date:
August 13, 2013
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
H01L21/60
Attorney, Agent or Firm:
Yamamoto Right clue
Tsujikawa 典範
Tsujikawa 典範