Title:
ALUMINUM SUBSTRATE FOR PRINTED CIRCUIT AND MANUFACTURING METHOD OF THE SUBSTRATE, AND PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE BOARD
Document Type and Number:
Japanese Patent JP2006024906
Kind Code:
A
Abstract:
To provide a manufacturing method of an aluminum substrate for a printed circuit, in which an excellent oxidation film is formed and adhesion to a resin sheet is improved.
The method includes a film formation step and a heating-and-drying step. In the film formation step, anodizing is performed to an aluminum sheet, in an electrolyte in which concentration of phosphoric acid is 3 to 20 mass%, and bath temperature is not lower than 25°C and less than 40°C, thereby an anodization film is formed on at least one surface. In the heating-and-drying step, heating is performed to the oxidation film at a temperature of 150 to 300°C for 0.5 to 3 hours.
Inventors:
NISHIZAWA KAZUYOSHI
Application Number:
JP2005165363A
Publication Date:
January 26, 2006
Filing Date:
June 06, 2005
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
H05K3/44; C25D11/04; C25D11/08; C25D11/18; H05K1/05
Attorney, Agent or Firm:
Hisayoshi Shimizu
Ken Takada
Yoshihito Shimizu
Ken Takada
Yoshihito Shimizu
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