Title:
AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POWER AMPLIFIER DIE
Document Type and Number:
Japanese Patent JP2022104788
Kind Code:
A
Abstract:
To provide a sufficient ground reference to a power transistor die.SOLUTION: An amplifier module 200 includes a module substrate 210. A thermal dissipation structure 316 extends through the module substrate. A ground contact 434 of a power transistor die 233 is coupled to a surface of the thermal dissipation structure. An encapsulant material 380 covers a mounting surface 209 of the module substrate and the power transistor die. A surface of the encapsulant material defines a contact surface 382 of the amplifier module. A ground terminal 244 is embedded within the encapsulant material and has a proximal end coupled to a ground terminal pad 344 and a distal end exposed at the contact surface. The ground terminal pad is electrically coupled to an RF ground layer 302 through a via 444. The RF ground layer is also electrically coupled to the thermal dissipation structure.SELECTED DRAWING: Figure 4A
Inventors:
JEFFREY KEVIN JONES
KEVIN KIM
FREEK EGBERT VAN STRATEN
IBRAHIM KHALIL
KEVIN KIM
FREEK EGBERT VAN STRATEN
IBRAHIM KHALIL
Application Number:
JP2021169270A
Publication Date:
July 11, 2022
Filing Date:
October 15, 2021
Export Citation:
Assignee:
NXP USA INC
International Classes:
H03F3/24; H03F1/02; H03F1/07; H03F3/68
Attorney, Agent or Firm:
Atsushi Honda
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