Title:
角速度センサー、電子機器および移動体
Document Type and Number:
Japanese Patent JP7347582
Kind Code:
B2
Abstract:
To provide an electronic device that can increase bond strength by making an interval h2 between a substrate and a lid body constant, and a method for manufacturing the electronic device.SOLUTION: An electronic device of the present invention comprises: a functional element 80 that is joined onto a substrate 10; and a lid body 50 that is joined to a joint part 61 on the substrate 10 with a joint material 60 and covers the functional element 80 to form an internal space with the substrate 10. The electronic device includes gap members 90 that are brought into contact with a surface of the substrate 10 facing the lid body 50 and a surface of the lid body 50 facing the substrate 10, and a height of the gap members 90 is larger than a thickness of the joint material 60.SELECTED DRAWING: Figure 2
Inventors:
Nao Uesaka
Application Number:
JP2022077997A
Publication Date:
September 20, 2023
Filing Date:
May 11, 2022
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
G01P15/08; B81B3/00; B81C1/00; G01P15/125; H01L29/84
Domestic Patent References:
| JP2013101031A | ||||
| JP2007165495A | ||||
| JP2001185635A |
Foreign References:
| US5837562 |
Attorney, Agent or Firm:
Satoshi Nakai
Hiroki Matsuoka
Masayuki Imamura
Hiroki Matsuoka
Masayuki Imamura
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