To provide an anisotropic conductive adhesive which enables easy repair with a general-purpose solvent, is excellent in adhesion to a polyimide, and exhibits a high peeling strength; and a heat seal connector using the same.

An insulating adhesive containing a polyimidesilicone resin, an epoxy resin, and a latent curing agent is mixed with a large number of conductive particles. The polyimidesilicone resin has a mol.wt. of 2,000-200,000 and a siloxane residue content represented by -(CH3)2SiO- of 20-80 wt.%. The use of the polyimidesilicone resin imparts heat resistance to the adhesive while enabling the flexibility due to a silicone component to be expected, and hence, the flexibility of the adhesive can be expected when the adhesive is used for a heat seal connector.