Title:
ANISOTROPIC CONDUCTIVE ADHESIVE
Document Type and Number:
Japanese Patent JP2015052114
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive with which high conduction reliability is maintained between a circuit board and a chip component and a good adhesion condition between the cured anisotropic conductive adhesive and them is maintained, even when a reliability test including heating of a mounted product, which is obtained by mounting the chip component on the circuit board by using the anisotropic conductive adhesive, is conducted.SOLUTION: When an elastic modulus of a cured product of an anisotropic conductive adhesive which includes conductive particles dispersed in an epoxy-based adhesive, containing an epoxy compound and a curing agent, at 35°C, 55°C, 95°C and 150°C is respectively denoted by EM, EM, EM, and EM, a rate of change of the elastic modulus between 55°C and 95°C is denoted by ΔEM, that between 95°C and 150°C is denoted by ΔEM, mathematical formulas (1)-(5) are satisfied.
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Inventors:
NAMIKI HIDEJI
KANIZAWA MORIYUKI
KATAYANAGI MOTOKI
KANIZAWA MORIYUKI
KATAYANAGI MOTOKI
Application Number:
JP2014184222A
Publication Date:
March 19, 2015
Filing Date:
September 10, 2014
Export Citation:
Assignee:
DEXERIALS CORP
International Classes:
C09J163/00; C09J9/02; C09J11/04; C09J11/06; C09J133/06; H01B1/22; H01B5/16
Domestic Patent References:
| JPH11335641A | 1999-12-07 | |||
| JP2008214449A | 2008-09-18 | |||
| JPH11335641A | 1999-12-07 | |||
| JP2008214449A | 2008-09-18 |
Foreign References:
| WO2009044732A1 | 2009-04-09 | |||
| WO2009044732A1 | 2009-04-09 |
Attorney, Agent or Firm:
Patent business corporation Tajime international patent firm
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