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Title:
ANISOTROPIC CONDUCTIVE FILM AND CONNECTION METHOD
Document Type and Number:
Japanese Patent JP3048973
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To prevent the generation of short circuit caused by conductive foreign matters by dispersing a cylindrical conductive particle in which a first insulating film for constituting stacking structure together with a conductive magnetic film is arranged on the outside in a thermosetting resin binder.
SOLUTION: A conductive magnetic film 13 is formed by plating on the surface of a lead (a first electrode) 2 on a base film (a first insulating member) 1, and the whole surface is covered with an insulating film 9. A conductive magnetic film 14 is formed by plating on the surface of a panel terminal (a second electrode) 6 on base glass (a second insulating member) 5, and the whole surface is covered with an insulating film 10. When the lead 2 and the panel terminal 6 are connected through a conductive particle 15, even if conductive foreign matters 8 exist, the contact of the lead 2 with the panel terminal 6 is prevented by the insulating films 9, 10. Part, which is taken in the inside of the cylinder of the conductive particle 15, of the conductive foreign matters 8 and part remaining on the outside are insulated by an insulating shell 12. Accordingly, the short between the lead 2 and the panel terminal 6 can be prevented.


Inventors:
Kouichi Kariya
Application Number:
JP23605097A
Publication Date:
June 05, 2000
Filing Date:
September 01, 1997
Export Citation:
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Assignee:
Kagoshima NEC Corporation
International Classes:
B32B27/18; C08L101/00; H01B5/00; H01B5/16; H01R11/01; H05K3/36; H05K3/32; (IPC1-7): H01B5/16; B32B27/18; C08L101/16; H01B5/00; H01R11/01; H05K3/36
Domestic Patent References:
JP669643A
JP3141506A
JP6234774U
JP61177325U
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)