Title:
ANISOTROPIC CONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP2011181525
Kind Code:
A
Abstract:
To provide an anisotropic conductive material capable of suppressing degradation of an epoxy resin and reducing connection resistance.
Conductive particles are dispersed in an insulating adhesive resin containing the epoxy resin, a cationic polymerization initiator, and core shell polymer particles having a glycidyl group in its shell part. This can improve an affinity between the shell part and the epoxy resin, suppress the degradation of the epoxy resin, and reduce the connection resistance.
Inventors:
HAYASHI SHINICHI
Application Number:
JP2011129294A
Publication Date:
September 15, 2011
Filing Date:
June 09, 2011
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP
International Classes:
H01B1/22; C09J9/02; C09J11/06; C09J133/06; C09J151/04; C09J151/06; C09J163/00; H01B5/16; H01R11/01
Domestic Patent References:
| JP2009517498A | 2009-04-30 | |||
| JP2005149764A | 2005-06-09 | |||
| JP2005126658A | 2005-05-19 | |||
| JP2011122028A | 2011-06-23 | |||
| JP2009203263A | 2009-09-10 | |||
| JP2000086989A | 2000-03-28 | |||
| JP2010536953A | 2010-12-02 |
Foreign References:
| WO2004108825A1 | 2004-12-16 |
Attorney, Agent or Firm:
Akira Koike
Seiji Iga
Toshiya Fujii
Nobuhiro Noguchi
Yusei Atsuya
Seiji Iga
Toshiya Fujii
Nobuhiro Noguchi
Yusei Atsuya