Title:
ANISOTROPIC CONDUCTIVE PASTE AND ITS USING METHOD
Document Type and Number:
Japanese Patent JP3864078
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide anisotropic conductive paste with high storage stability, high dispenser coating workability, no generation of lost resin, bubbles, and exudation in thermo compression bonding, high bonding reliability and high connection reliability even in high temperature and high humidity, and high repairing capability, and to provide a using method of the anisotropic conductive paste.
SOLUTION: This anisotropic conductive paste contains (I) 30-80 percentage by mass of epoxy resin; (II) 10-50 percentage by mass of a phenol base curing agent; (III) 5-25 percentage by mass of high softening point fine particles; and (IV) 0.1-25 percentage by mass of conductive particles. This anisotropic conductive paste is used to connect an electric circuit wiring formed on one board to an electric circuit wiring formed on the other board.
Inventors:
Koji Mizuta
Murata Tatsushi
Nakahara Makoto
Kira Takatoshi
Ike Sugi Daisuke
Murata Tatsushi
Nakahara Makoto
Kira Takatoshi
Ike Sugi Daisuke
Application Number:
JP2001367579A
Publication Date:
December 27, 2006
Filing Date:
November 30, 2001
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
Sharp Corporation
Sharp Corporation
International Classes:
C08K3/00; H01B1/22; C08G59/62; C08K9/02; C08L33/06; C08L63/00; C08L83/04; C08L101/00; C09J9/02; C09J161/06; C09J163/00; (IPC1-7): H01B1/22; C08G59/62; C08K3/00; C08K9/02; C08L33/06; C08L63/00; C08L83/04; C08L101/00; C09J9/02; C09J161/06; C09J163/00
Domestic Patent References:
| JP6184282A | ||||
| JP2000345010A | ||||
| JP2001049086A |
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura
Koji Makimura