To provide an anisotropically electroconductive film exhibiting stable and excellent adhesion characteristics and continuity characteristics even when contact-bonded at a low temperature in a short time.
There is provided an anisotropically electroconductive film which is installed between circuits standing opposite to each other and subjected to heating and pressurizing at a temperature of not higher than 150°C to connect and adhesively fix these circuits, which film comprising a thermosetting adhesive comprising a monomer containing an acryloxy or a methacryloxy group having dispersed therein electroconductive particles and having admixed therewith a low temperature-decomposable organic peroxide having a 10-hr half-life temperature of not higher than 80°C.
JP2000312070 | METHOD OF CONNECTING ELECTRODE TERMINAL |
JP4772490 | Method for manufacturing conductive particles |
WO/2005/076676 | CIRCUIT CONSTITUTING BODY |
SAKURAI MAKOTO
MIURA TERUO
MORIMURA YASUHIRO