To allow one power source to cope with a plurality of anodization conditions.
The anodization device 10 is provided with: a treatment tank 18 stored with an electrolytic solution 44; a power source unit 16 of applying voltage between each wafer 48 and a cathode 46 arranged at the inside of the treatment tank 18; and a control unit 14. The control unit 14 has a data memory section 28 of memorizing anodization conditions corresponding to the plurality of wafers 48 arranged at the inside of the treatment tank 18. Further, the anodization device 10 has a change section 20 of changing the plurality of wafers 48 and connecting them to the power source unit 16. An anodization control section 34 in the control unit 14 reads out the anodization conditions memorized in the data memory section 28, and controls the change section 20 and the power source unit 16, so as to subject the plurality of wafers 48 to anodization in succession.
| WO/2023/243078 | LEAKAGE DETERMINATION METHOD AND PLATING DEVICE |
| JP4197288 | Substrate plating equipment |
MITSUI YUJI
KURATA YOICHI
Okubo Misao
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