Title:
アンテナ基板およびその製造方法
Document Type and Number:
Japanese Patent JP6749062
Kind Code:
B2
Abstract:
The present disclosure includes a cap substrate 10 including a first antenna conductor 12 located on upper and lower surfaces of a first insulating layer 11; a frame substrate 20 including an opening 22 located in the second insulating layer 21 and having an outer periphery that surrounds an individual of or a collective number of outer peripheries of the plurality of first antenna conductors 12 in a top view; a base substrate 30 including a second antenna conductor 32 located on an upper surface of a third insulating layer 31; a first adhesive material 14 adhering the first insulating layer 11 and the second insulating layer 21; and a second adhesive material 23 adhering the second insulating layer 21 and the third insulating layer 31; and the first adhesive material 14 and the second adhesive material 23 include a first bonding member 15 and a second bonding member 16 having an adhesive strength to the second insulating layer 21 greater than that of the first bonding member 15.
Inventors:
Keizo Sakurai
Application Number:
JP2018557684A
Publication Date:
September 02, 2020
Filing Date:
December 11, 2017
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01Q1/38; H01P11/00; H01Q13/08; H01Q21/06; H05K1/02
Domestic Patent References:
| JP2000138525A | ||||
| JP2256305A | ||||
| JP201666699A | ||||
| JP864938A | ||||
| JP2006312252A |