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Patent Searching and Data


Title:
アンテナモジュールおよびその製造方法
Document Type and Number:
Japanese Patent JP6870036
Kind Code:
B2
Abstract:
An embodiment of the present invention provides an antenna module including a base frame and a conductive pattern disposed on the base frame, wherein the conductive pattern includes a first conductor layer disposed on the base frame, a second conductor layer disposed on the first conductor layer, and a third conductor layer disposed on the second conductor layer. In addition, another embodiment of the present invention provides a method of manufacturing an antenna module.

Inventors:
Cho, Sungbok
Application Number:
JP2019131200A
Publication Date:
May 12, 2021
Filing Date:
July 16, 2019
Export Citation:
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Assignee:
LS Mtron Ltd.
International Classes:
H01Q1/38; H01P11/00; H05K1/09; H05K3/18; H05K3/24
Domestic Patent References:
JP2014220390A
JP2008158219A
JP2014082747A
JP2012136769A
JP2018022634A
JP2008252089A
JP2007274528A
JP9116306A
Foreign References:
US20110165915
KR101557276B1
KR1020140106862A
US20080224937
US20140106085
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Satoru Asakura
Takeshi Sekine
Sanami Daigo