Title:
研磨パッド窓のための散乱防止層
Document Type and Number:
Japanese Patent JP4575677
Kind Code:
B2
Abstract:
An anti-scattering layer (50) for polishing pad windows as used in chemical-mechanical planarization (CMP) systems is disclosed. The invention finds particular use in circumstances where the windows (40) have a roughened lower surface (52). The anti-scattering layer (50) is formed over the roughened lower surface (52) of the window in a manner that significantly reduces light scattering while making optical in-situ measurements of a wafer undergoing a CMP process. The reduced light scattering results in an increased signal strength, which makes for more robust optical in-situ measurement capability.
Inventors:
John Buoy H. Roberts
Application Number:
JP2004026303A
Publication Date:
November 04, 2010
Filing Date:
February 03, 2004
Export Citation:
Assignee:
Rohm and Haas Electronic Materials CMP Housings, Inc.
International Classes:
B24B49/02; H01L21/304; B24B37/20; B24B49/12; B24D7/12; B24D13/14
Domestic Patent References:
| JP11070469A | ||||
| JP2001179617A | ||||
| JP2003285257A | ||||
| JP2005538571A |
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Fumio Shinoda