Title:
Antimony free glass, antimony free fritto, and the glass package by which hermetic sealing is carried out with the fritto
Document Type and Number:
Japanese Patent JP6239766
Kind Code:
B2
Abstract:
An antimony-free glass suitable for use in a frit for producing a hermetically sealed glass package is described. The hermetically sealed glass package, such as an OLED display device, is manufactured by providing a first glass substrate plate and a second glass substrate plate and depositing the antimony-free frit onto the first substrate plate. OLEDs may be deposited on the second glass substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first glass substrate plate to the second glass substrate plate and also protects the OLEDs. The antimony-free glass has excellent aqueous durability, good flow, low glass transition temperature and low coefficient of thermal expansion.
Inventors:
Drake, Melinda Ann
Morena, Robert Michael
Morena, Robert Michael
Application Number:
JP2016538986A
Publication Date:
November 29, 2017
Filing Date:
August 22, 2014
Export Citation:
Assignee:
CORNING INCORPORATED
International Classes:
C03C3/21; C03C8/08; C03C8/24; C03C27/06; H01L23/02; H05B33/04
Domestic Patent References:
JP2012505827A | ||||
JP2010184852A | ||||
JP2013133343A | ||||
JP2013157161A | ||||
JP2008117767A | ||||
JP2006524419A |
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma
Go Sakuma