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Patent Searching and Data


Title:
APPARATUS FOR APPLYING CHEMICAL LIQUID TO SUBSTRATE
Document Type and Number:
Japanese Patent JP2001009345
Kind Code:
A
Abstract:

To provide a chemical liquid application apparatus for a substrate capable of applying a chemical liquid with a thin and even thickness to a substrate.

This chemical liquid application apparatus 10 comprises an unrolling reel 14 on which a substrate 12 uncoated with a chemical liquid is rolled, unrolling rollers 15, 15 as transporting means for unrolling the substrate 12 from the unrolling reel 14, a first chemical liquid tank 18 storing an undercoating liquid 16, which is a first chemical liquid, guide rollers 20, 21, 22 for sending the substrate 12 to the first chemical liquid tank 18 as to immerse the substrate in the undercoating liquid 16 and taking the substrate 12 out of the first chemical liquid tank 18, and a film thickness adjustment part 24. The film thickness adjustment part 24 comprises pinching members 50, 50 made of felt and pinches the substrate 12 with the pinching members 50, 50 after the substrate is immersed in the chemical agent.


Inventors:
SAKUMA EIJI
NAKAJIMA HIROYUKI
Application Number:
JP17945099A
Publication Date:
January 16, 2001
Filing Date:
June 25, 1999
Export Citation:
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Assignee:
NICHIBEI KK
International Classes:
B05C3/12; B05C11/02; (IPC1-7): B05C11/02; B05C3/12
Attorney, Agent or Firm:
Hisako Ishido (3 outside)