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Patent Searching and Data


Title:
APPARATUS FOR FORMED GROOVING WORK OF WAFER BEVEL POLISHING BUFF
Document Type and Number:
Japanese Patent JPH06163488
Kind Code:
A
Abstract:

PURPOSE: To provide an apparatus which can make formed grooving work easily and precisely and dispenses with slurry countermeasure without influencing a puff mounting precision.

CONSTITUTION: This apparatus comprises a groove working bite 14 sucked by a wafer sucker 5, a jig 15 which is a means for locking the rotation of the sucker 5, and a stopper 11 which regulates the rotation amount of an arm 1 and positions the tip of a grooving bite 14. When the formed grooving work of a puff 6 is necessary, the groove working bite 14 is sucked by the wafer sucker 5 without removing the puff 6, and the puff 6 can be subjected to formed grooving work by the groove working bite 14 with the result that the precision of mounting the puff 6 undergoes no influence. In this case, the tip of the groove working bite 14 can be positioned with high precision by the stopper 11, and the groove working bite 14 is sucked by the wafer sucker 5 only during formed grooving work, so that formed grooving work can be made with high precision, slurry countermeasure against the groove working bite 14 is dispensed with.


Inventors:
HASEGAWA FUMIHIKO
OTANI TATSUO
KURODA YASUYOSHI
Application Number:
JP31844592A
Publication Date:
June 10, 1994
Filing Date:
November 27, 1992
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK
International Classes:
B23B5/00; B24B9/00; H01L21/304; (IPC1-7): H01L21/304; B23B5/00; B24B9/00