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Title:
APPARATUS FOR FUSING SOLID LAYER OF ELECTRICALLY CONDUCTIVE MATERIAL
Document Type and Number:
Japanese Patent JP3691859
Kind Code:
B2
Abstract:

PURPOSE: To provide an apparatus which can control the intake of energy into electrically conductive melt by enabling the electrical melting of bottom sculls, closed cocks or closed plates during the formation of a continuing injection flow.
CONSTITUTION: There are arranged at least one central bottom portion 27 having a slit which is provided with at least two separately controllable inductance coils 10 and 11, and exists in an area of the upper inductance coil 10 to be cooled by a fluid. The bottom portion forms a container, a pot 7 or the like, and the pot 7 or the like surrounds molten metal. Furthermore, the pot 7 or the like is formed of an electrically conductive material in an area of at least infiltration depth of an electromagnetic field or completely.


Inventors:
Matias bloom
Aloc Koutohoree
Hans-Günter Ferman
Wilfried Goi
Franz Hugo
Felix Muller
Wolfgang Schwarz
Hardy Weissweiler
Application Number:
JP14045694A
Publication Date:
September 07, 2005
Filing Date:
June 22, 1994
Export Citation:
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Assignee:
ALD Vacuum Technologies AG
International Classes:
F27B14/18; B22D41/14; F27B14/06; F27D3/15; F27D11/06; (IPC1-7): F27B14/18; F27D11/06
Domestic Patent References:
JP5018677A
JP3281709A
JP6128611A
JP63207984A
Foreign References:
US4762553
US5084091
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Reinhard Einsel