Title:
APPARATUS FOR INSPECTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2004214518
Kind Code:
A
Abstract:
To provide an apparatus for inspecting semiconductors which enhances reliability in electrical contact between a silicon substrate and a second substrate, reduces electrostatic capacity of the silicon substrate, and enables inspection under high-speed operation.
The apparatus ensures reliability in electrically connecting the silicon substrate 1 and the second substrate 2 through a wire 6, reduces processes for making a surface of the silicon substrate 1, i.e. a surface other than a surface where a probe 11 is formed, and enables inspection under high-speed operation since a wiring area at a through hole is reduced and thus the electrostatic capacity of the silicon substrate 1 is reduced.
Inventors:
AONO TAKANORI
KONO RYUJI
KANAMARU MASATOSHI
NAGATA TATSUYA
AOKI HIDEYUKI
KONO RYUJI
KANAMARU MASATOSHI
NAGATA TATSUYA
AOKI HIDEYUKI
Application Number:
JP2003001690A
Publication Date:
July 29, 2004
Filing Date:
January 08, 2003
Export Citation:
Assignee:
RENESAS TECH CORP
International Classes:
G01R31/26; G01R1/073; G01R31/28; H01L21/66; (IPC1-7): H01L21/66; G01R1/073; G01R31/26; G01R31/28
Attorney, Agent or Firm:
Yasuo Sakuta
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