Title:
APPARATUS FOR MEASURING FLOW RATE OF SLURRY
Document Type and Number:
Japanese Patent JP2001281034
Kind Code:
A
Abstract:
To provide an apparatus for measuring the flow rate of a slurry, capable of easy handling and measuring the flow rate of a solid in the slurry, at a low cost.
The apparatus for measuring the flow rate of the slurry comprises a measuring tube in which the slurry flows. The apparatus comprises a volume flowmeter, provided in the tube to measure a volume flow rate, a weight flowmeter provided in the tube to measure a weight flow rate, and an arithmetic unit for calculating the solid weight flow rate from a volume flow rate measured value of the volume flow rate and weight flow rate measured value of the weight flowmeter.
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Inventors:
ARIKAWA SEIZO
WAKATSUKI KATSUSHI
WAKATSUKI KATSUSHI
Application Number:
JP2000091636A
Publication Date:
October 10, 2001
Filing Date:
March 29, 2000
Export Citation:
Assignee:
YOKOGAWA ELECTRIC CORP
International Classes:
G01F1/74; (IPC1-7): G01F1/74