Title:
複数の同一のダイを有する単一のチップパッケージを用いてニューラルネットワークタスクを処理するための装置および機構
Document Type and Number:
Japanese Patent JP7473593
Kind Code:
B2
Abstract:
Apparatus and methods for processing neural network models are provided. The apparatus can comprise a plurality of identical artificial intelligence processing dies. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies can include at least one inter-die input block and at least one inter-die output block. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies is communicatively coupled to another artificial intelligence processing die among the plurality of identical artificial intelligence processing dies by way of one or more communication paths from the at least one inter-die output block of the artificial intelligence processing die to the at least one inter-die input block of the artificial intelligence processing die. Each artificial intelligence processing die among the plurality of identical artificial intelligence processing dies corresponds to at least one layer of a neural network.
Inventors:
Dasari, Udai Kumar
Temamu, Olivier
Narayana Swami, Rabbi
Woo Dong Hyuk
Temamu, Olivier
Narayana Swami, Rabbi
Woo Dong Hyuk
Application Number:
JP2022096437A
Publication Date:
April 23, 2024
Filing Date:
June 15, 2022
Export Citation:
Assignee:
Google LLC
International Classes:
G06N3/063; G06N3/04
Domestic Patent References:
| JP2236659A | ||||
| JP2010109111A |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office