Title:
基板への接着テープの貼付装置及び貼り付け方法
Document Type and Number:
Japanese Patent JP7401904
Kind Code:
B2
Abstract:
To neatly stick an adhesion tape such as a protective tape, or the like to a substrate such as a wrapped wafer at high work efficiency and at low cost.SOLUTION: A sticking apparatus 1 comprises: a support table 40; a sticking roller 41; a pressing roller 42; a movement mechanism that moves at least one of both the sticking roller 41 and the pressing roller 42, and the support table 40 so as to relatively move the sticking roller 41 and the pressing roller 42 on a wafer 2 at the same time; and control means that controls the movement mechanism. The pressing roller 42 is arranged so as to move in front of the sticking roller 41 when relatively moving on the wafer 2. The control means controls the movement mechanism so that a sticking roller 41 sticks a protective tape 3 to the wafer 2 in order from a part of the one end side, and the pressing roller 42 presses the wafer 2 against the support table 40 before the sticking roller 41 presses the protective tape 3 to the wafer 2.SELECTED DRAWING: Figure 6
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Inventors:
Yoshiaki Ueda
Kazuya Fujitani
Kazuya Fujitani
Application Number:
JP2020019154A
Publication Date:
December 20, 2023
Filing Date:
February 06, 2020
Export Citation:
Assignee:
Takatori Co., Ltd.
International Classes:
H01L21/683; B65H37/04; H01L21/301
Domestic Patent References:
| JP2010272755A | ||||
| JP201996704A | ||||
| JP201389612A | ||||
| JP2004342772A | ||||
| JP2013232583A | ||||
| JP2006210464A |
Attorney, Agent or Firm:
Saegusa International Patent Office