Title:
APPARATUS AND METHOD FOR HANDLING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP3916473
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a substrate carrying device from stopping operating and a substrate from being damaged when the carrying destination of the substrate to be carried inhibits the substrate from being carried in.
SOLUTION: A resist coating/developing processing system has a cassette station, a processing station, and an interface station. A 2nd wafer carrying body which carries a wafer from a high-precision temperature control unit (CPL-G9) provided to the interface station to an in-stage of an exposure device mounts a held wafer temporarily on a rewinding unit (RSM) if the wafer can not be carried in the in-stage after being carried out of the high-precision temperature control unit (CPL-G9) since the wafer is ready to be carried in the in-stage.
Inventors:
Ryo Miyata
Makio Higashi
Eki Wada
Makio Higashi
Eki Wada
Application Number:
JP2002023698A
Publication Date:
May 16, 2007
Filing Date:
January 31, 2002
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/677; G03D3/00; G03F7/20; H01L21/027; (IPC1-7): H01L21/68; H01L21/027
Domestic Patent References:
| JP7297258A | ||||
| JP5338782A | ||||
| JP9293767A | ||||
| JP11111800A |
Attorney, Agent or Firm:
Hiroshi Takayama