To eliminate contacting of a transfer plate or the like with a solder paste on a circuit board, in the apparatus for loading a chip component on the board by dropping in the component from the plate.

This apparatus for loading the chip component comprises a chip component array 15, having a slide plate 4 and a solder paste contact preventing plate 5 superposed under the transfer plate 3 for positioning and arraying chip components 7 and mounting the plate 4 and the plate 5 in a frame 6. In this case, the plate 5 is made of the array 15 formed in a mesh-like state to sew between the solder pastes 2 printed on the circuit board 1, when the array 15 is aligned and placed on the board 1. The components 7, transferred to the chip component positioning hole 11 of the plate 3, are dropped on the board 1 positioned under the array 15 by drawing the plate 4 from the frame 6, and the components 7 are placed on the board 1.