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Title:
APPARATUS AND METHOD FOR MACHINING PLANAR SURFACE
Document Type and Number:
Japanese Patent JP2003007661
Kind Code:
A
Abstract:

To provide an apparatus and method for machining a planar surface of a wafer, capable of improving throughput without damaging the wafer.

In the apparatus for machining planar surface 10, a grinding stage 22 is set on a body 12, on which a rough grinding stage 18 and a finishing grinding stage 20 are set, and rough grinding, finish grinding, and polishing of a wafer 28 are implemented in the identical apparatus for machining the planar surface 10. A cleaning stage 23 for cleaning a polishing cloth 56 of the polishing stage 22 set in the apparatus for machining the planar surface 10 cleans the polishing cloth 56 in the identical apparatus 10, when it is smeared. A set of an etching apparatus 150 in the apparatus for machining planar surface 10 enables a series of planar machining from rough grinding to etching to be processed using a single apparatus.


Inventors:
ISHIKAWA TOSHIHIKO
KATAGIRI YASUSHI
Application Number:
JP2002140537A
Publication Date:
January 10, 2003
Filing Date:
November 11, 1999
Export Citation:
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Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
B24B7/20; B24B37/04; H01L21/304; (IPC1-7): H01L21/304; B24B7/20; B24B37/04
Domestic Patent References:
JPH06338484A1994-12-06
JPH0740239A1995-02-10
JPH10303152A1998-11-13
JPH05226308A1993-09-03
JPH10166264A1998-06-23
JPS6076959A1985-05-01
JPS63169209A1988-07-13
JPS6181846U1986-05-30
JPS641840U1989-01-09
JPH08153695A1996-06-11
JPH0529288A1993-02-05
Other References:
辻薦, 精密洗浄技術, JPN4006004966, pages 16 - 17, ISSN: 0000722003
辻薦, 精密洗浄技術, JPNX006034352, pages 16 - 17, ISSN: 0000759816
辻薦, 精密洗浄技術, JPNX006060021, pages 16 - 17, ISSN: 0000798651
Attorney, Agent or Firm:
Kenzo Matsuura



 
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