PURPOSE: To obtain a developing apparatus wherein it reduces the amount of developing solution used in a preliminary developing operation and it prevents an uneven developing operation and a developing residue regarding the developing apparatus and a developing method which are used for a semiconductor wafer.

CONSTITUTION: A semiconductor manufacturing apparatus is provided with the following: a wafer support means 2 which is installed inside a treatment cup 1 and which supports and turns a semiconductor wafer 3; and a developing- solution discharge means 4 which is installed so as to be faced with the semiconductor wafer 3 supported by the wafer support means 2 and which drops a developing solution on the semiconductor wafer 3. In the semiconductor manufacturing apparatus, a rotary roller brush 5 which is moved on the semiconductor wafer 3 while it is being turned by keeping a slight gap with reference to the semiconductor wafer 3 and which discharges the developing solution is installed.