Title:
APPARATUS AND METHOD FOR PLASMA PROCESSING
Document Type and Number:
Japanese Patent JP2004111381
Kind Code:
A
Abstract:
To provide an apparatus and method for plasma processing capable of performing plasma processing excellent in processing accuracy by suppressing scattering of radicals and suppressing blurring of a processed area of a substrate.
The plasma processing apparatus includes a microplasma source that can be arranged oppositely in a vicinity of an object to be processed, a power source supplying power to the microplasma source, and an ejecting opening supplying an active particle to be operated by the processed object. A taper is provided at an end toward the processed object of the microplasma source. The ejecting opening is formed on an end surface of the taper.
Inventors:
SAITO MITSUHISA
YASHIRO YOICHIRO
OKUMURA TOMOHIRO
KIMURA TADASHI
YASHIRO YOICHIRO
OKUMURA TOMOHIRO
KIMURA TADASHI
Application Number:
JP2003301222A
Publication Date:
April 08, 2004
Filing Date:
August 26, 2003
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05H1/24; H01L21/3065; (IPC1-7): H05H1/24; H01L21/3065
Attorney, Agent or Firm:
Osamu Kawamiya
Mitsuo Wada
Mitsuo Wada