Title:
APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
Document Type and Number:
Japanese Patent JP3643341
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To inhibit swell in a liquid film of a coating liquid at the outer- periphery section of a wafer.
SOLUTION: At an upper end section 54b of a cup 54, a plurality of impellers 56 projecting to the side of an opening Q are provided. Each impeller 56 is aligned in the circumference direction of the opening Q. Then, when a wafer W is to be rotated and the film thickness of a coating liquid on the wafer W is to be adjusted, an opening rate at the opening Q is reduced by the impeller 56, thus reducing an air current flowing into the cup 54, and reducing the speed of the air current near the outer-periphery section of the wafer W. As a result, the drying speed of the coating liquid at the outer-periphery section of the wafer W becomes slow, and the deposition of the dried coating liquid to the outer-periphery section of the wafer W is inhibited.
Inventors:
Takashi Tanaka
Shinji Nagashima
Masahiko Nakajima
Shinji Nagashima
Masahiko Nakajima
Application Number:
JP2001376055A
Publication Date:
April 27, 2005
Filing Date:
December 10, 2001
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G03F7/16; B05C11/08; H01L21/027; H01L21/31; (IPC1-7): H01L21/31; B05C11/08; G03F7/16; H01L21/027
Domestic Patent References:
| JP9122558A | ||||
| JP2144169A | ||||
| JP63313160A | ||||
| JP63141314A | ||||
| JP2001155981A |
Attorney, Agent or Firm:
Tetsuo Kanamoto
Miaki Kametani
Koji Hagiwara
Miaki Kametani
Koji Hagiwara
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