Title:
APPARATUS AND METHOD FOR REMOVING BONDING WIRE USING ALTERNATING CURRENT OF FLUID
Document Type and Number:
Japanese Patent JP2534428
Kind Code:
B2
Abstract:
PURPOSE: To provide a method and apparatus for removing a wire, bonded between a contact pad of a chip and a contact pad of a substrate by using an alternating flow of a fluid.
CONSTITUTION: A nozzle 32 having a plurality of air jets in a cavity in which a chip is housed is arranged on the chip, so as to surround chip contact pads 6, substrate contact pads 10, and wires 4 bonded between the pads 6 and 10. Air flows from the plurality of jets, alternate air currents in the clockwise and counterclockwise directions are generated, a plurality of wires are bent forward and backward, fatigue is generated at contact points between the substrate contact pads and the chip contact pads 6, and the wires 4 are cut at the contact points almost at the same time. The nozzle 32 has holes, and air escapes from the holes. The cut wires 4 are carried out and caught by a filter.
Inventors:
BERUNARUDO HERUNANDESU
REIMONDO ROBAATO HOOTON
ISUMAIRU CHEUDETO NOYAN
MAIKERU JON PARUMAA
MAAKU BII RITSUTAA
REIMONDO ROBAATO HOOTON
ISUMAIRU CHEUDETO NOYAN
MAIKERU JON PARUMAA
MAAKU BII RITSUTAA
Application Number:
JP34178292A
Publication Date:
September 18, 1996
Filing Date:
December 22, 1992
Export Citation:
Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
H01L21/60; B08B3/02; B23K1/018; B26F3/00; H05K13/04; (IPC1-7): H01L21/60; B08B3/02; B26F3/00
Domestic Patent References:
| JP61205800U | ||||
| JP4102659U |
Attorney, Agent or Firm:
Kiyoshi Goda (2 outside)