Title:
APPARATUS AND METHOD FOR THERMAL SHOCK TEST
Document Type and Number:
Japanese Patent JP2002174577
Kind Code:
A
Abstract:
To realize a thermal-shock testing apparatus with which a thermal strain can be measured precisely, by which thermal stress is increased and by which the test time can be shortened.
The thermal-shock testing apparatus tests the resistance, with reference to the thermal shock of a bonded part to a ceramic substrate 3 of a semiconductor chip 1 mounted on the ceramic substrate 3. Two heating and cooling devices 4, 5, which execute heating control operation and cooling control operation are installed. Regarding parts facing the joined part, one is heated and the other is cooled mutually alternately by the devices 4, 5.
Inventors:
IWATA KAZUYUKI
YOSHIDA YOSHIHIRO
SAKATSU TSUTOMU
OKURA HIDEAKI
KUWAZAKI SATOSHI
YOSHIDA YOSHIHIRO
SAKATSU TSUTOMU
OKURA HIDEAKI
KUWAZAKI SATOSHI
Application Number:
JP2000372272A
Publication Date:
June 21, 2002
Filing Date:
December 07, 2000
Export Citation:
Assignee:
RICOH KK
International Classes:
G01N17/00; G01N3/60; (IPC1-7): G01N3/60; G01N17/00
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