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Title:
APPARATUS AND METHOD FOR TREATING WITH LIQUID
Document Type and Number:
Japanese Patent JP2002119904
Kind Code:
A
Abstract:

To provide a solution treatment apparatus and a method capable of raising throughput of treatment.

There is provided a solution treatment apparatus 24a, 24b, or 24c comprising a treatment container 49 that houses a substrate G; a mechanism 40 that holds the substrate G; a mechanism 42 that moves the mechanism 40 between the substrate treatment position in the container 49 and the substrate conveying position above the same; a treatment solution feeding nozzle 80 that feeds the treatment solution onto the substrate G held by the mechanism 40; a nozzle drive mechanism 52 that moves the nozzle 80 between the standby position 115 and the scan position S above this position and that moves it onto the substrate G from the position S; and a control unit 70 that controls the mechanism 42 and the mechanism 52. The unit 70 moves the nozzle 80 from the position 115 to the position S while the mechanism 40 holding the substrate G is being made movable from the substrate convey position to the substrate treatment position.


Inventors:
YAMAZAKI TAKESHI
KUBOTA HIKARI
HONDA YOICHI
HAMANO TADATAKA
YAHIRO SHUNICHI
MIYAZAKI KAZUHITO
Application Number:
JP2000313841A
Publication Date:
April 23, 2002
Filing Date:
October 13, 2000
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
B05D1/40; B05C5/00; B05C11/08; B05C11/10; H01L21/027; (IPC1-7): B05C5/00; B05C11/08; B05C11/10; B05D1/40; H01L21/027
Attorney, Agent or Firm:
Hiroshi Takayama