To provide a molding apparatus which can correspond to cracking and open many through-holes by a simple mechanism.
In the molding apparatus 1, a cavity 20 filled with a raw material is formed between a fixed mold 2 and a movable mold 3, and a pin 5 is set in the cavity 20 to move through a guide hole 21 formed in one of both molds. In one of both molds 2 and 3, an energizing mechanism 4 having a push spring 50 energizing the pin 5 toward the cavity 20 is installed. The pin 5 is set to move between a first position where the end contacts the fixed mold 2 or the movable mold 3 under pressure by the energization of the push spring 50 during the clamping of both molds 2 and 3 and a second position where the end is pushed further from the first position by the push spring 50 and contacts the fixed mold 2 or the movable mold 3 during cracking to separate the movable mold 3 from the fixed mold 2 after the mold clamping.
YOSHII MOTOKAZU
SHIMOJIMA SHINICHI
EGUCHI TAKESHI
YAMASEI SEISAKUSHO:KK
Takao Miyano
Koichi Kitazumi
Toshiya Nagatsuka
Takahiro Kutoku
Next Patent: PLATE DISCHARGE APPARATUS AND STENCIL PRINTING APPARATUS