Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
APPARATUS FOR MONITORING STRUCTURE SUBJECT TO WEAR
Document Type and Number:
Japanese Patent JPH01172646
Kind Code:
A
Abstract:

PURPOSE: To monitor a minimum wall thickness that is functional and effective by installing a sensor having at least one heat resistant electricity transmission wire in a recess in surface of structure subject, and constituting the length of the sensor projective from the recess corresponding to a predetermined minimum wall thickness of the structure subject.

CONSTITUTION: As far as the thickness of skid material 1 is not smaller than the minimum wall thickness L, the sensor 4 does not make any response. The sensor 4 has a heat resistance because of its special structure to resist high temperature during the whole brake course that is relatively high temperature. When the skid 1 is scraped to the minimum wall thickness L, it goes worse in the continuous processes. At this time, at first, the outer conductor 18 of the transmission wire 5 is scraped, and the capacity of the transmission wire 5 is therewith changed, the capacity changing of the wire is evaluated by an arrangement 6, and at last the skid 1 is exchanged. When loss of the skid 1 goes on to such a state that the transmission wire 5 and insulation of the inner conductor 15 are nearly breakdown, a short circuit occurring at this time, insulation of the conductor 15 are also indicated in an apparatus 6.


Inventors:
UERUNERU FUITSUSHIERU
FURIIDORITSUHI SHIYUAUERU
KURUTO KURAAMERU
Application Number:
JP29031988A
Publication Date:
July 07, 1989
Filing Date:
November 18, 1988
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KABELMETAL ELECTRO GMBH
THYSSEN INDUSTRIE
International Classes:
F16D66/02; (IPC1-7): F16D66/02
Attorney, Agent or Firm:
Mitsuyoshi Ezaki (1 person outside)



 
Previous Patent: FRONT DISC BRAKE DEVICE

Next Patent: MANUFACTURE OF FIXED MEMBER