PURPOSE: To provide an apparatus for mounting a semiconductor chip in which the chip can be rapidly and accurately positioned in the case of fixing the chip to a board and a production efficiency can be improved.

CONSTITUTION: A positioning mechanism is provided between a semiconductor chip holding mechanism 2 and a board holding mechanism 4. In the positioning mechanism, an image of a semiconductor chip 1 incident from an upper part to an optical waveguide 6 through a window 7 is reflected by a half mirror 9, and advanced to a left of the drawing in the waveguide 6. On the other hand, the image of a board 3 incident from a lower part into the waveguide 6 through a window 8 is once reflected by the mirror 9 to a totally reflecting mirror 10 side, then reflected by the mirror 10, passed through the mirror 9, and advanced to a left of the drawing in the waveguide 6. Thus, a combined image made by superposing the image of a lower surface of the chip 1 on the image of an upper surface of the board 3 is formed at a left side of the waveguide 6, and imaged by a television camera 11.