PURPOSE: To provide an apparatus for producing a circuit device with which connection having sufficient strength of adhesion and electrical characteristics is realized at a temp. lower than heretofore.

CONSTITUTION: This apparatus has a pressing tool 5 to execute impression of ultrasonic waves by pressing an electrode terminal part 2 and a wiring pattern 14 to be electrically connected thereto in a direction of bringing both into tight contact with each other in the state of superposing both on each other via an anisotropically conductive film or anisotropically conductive adhesive layer 3 interposed therebetween and a photoirradiation means for heating the regions where the electrode terminal part 2 and the wiring pattern 14 to be electrically connected thereto are superposed via the anisotropically conductive film or anisotropically conductive adhesive layer 4 by photoirradiation. The electrode terminal part 2 and the wiring pattern 14 to be electrically connected thereto are brought into tight contact with each other by adhering the anisotropically conductive film or anisotropically conductive adhesive 3 by the pressing tool 5 and are heated by ultrasonic impression and photoirradiation by the photoirradiation means, by which both are electrically and mechanically joined.