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Title:
AQUEOUS ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2008081564
Kind Code:
A
Abstract:

To provide an aqueous adhesive composition, while maintaining an equivalent various adhesive physical properties to those of solvent type adhesives, overcoming defects that conventional aqueous emulsion type adhesives have, and excellent in waterproof property.

This aqueous adhesive composition contains copolymer emulsion obtained by performing the emulsion polymerization of a mixture consisting of 100 pts.wt. monomer consisting of (a) 7 to 99.7 wt.% (meth)acrylic acid alkyl ester having a 1-14C alkyl group, (b) 0.1 to 10 wt.% polymerizable unsaturated carboxylic acid, (c) 0.1 to 10 wt.% copolymerizable vinyl monomer having an alcoholic hydroxy group, and 0.1 to 1.0 wt.% acetoacetoxyethyl methacrylate, and (d) 1 to 10 pts.wt. tackiness-imparting resin containing 30 wt.% terpene-based tackiness-imparting resin, in the presence of (e) 0.1 to 10 pts.wt. surfactant in an aqueous medium.


Inventors:
YAMANAMI SHUICHI
IRIE TAKASHI
HINOKI TAKESHI
Application Number:
JP2006261591A
Publication Date:
April 10, 2008
Filing Date:
September 27, 2006
Export Citation:
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Assignee:
TOYO INK MFG CO
International Classes:
C09J151/06; C09J7/02