Title:
AQUEOUS RESIN DISPERSION
Document Type and Number:
Japanese Patent JP2563147
Kind Code:
B2
Abstract:
PURPOSE: To provide an aqueous resin dispersion which can cure rapidly to form a film having good adhesion, excellent flexibility, chemical resistance, etc., and extremely excellent sanitary properties when applied to a metallic substrate.
CONSTITUTION: An aqueous resin dispersion prepared by dispersing a carboxylated acryl resin (A), an epoxy resin (B) and a phenolic resin (C) in an aqueous medium in the presence of an amine, wherein component C comprises an allyl ether-type phenolic resin in which 20 to below 80% of the phenolic hydroxyl groups are allyl-etherified, the weight-average molecular weight is 250-800, and the content of a low-molecular weight component of a molecular weight of below 250 is 10wt.% or below, and component (A) and component (B) are partially combined with each other.
Inventors:
MORI KATSUHIRO
KOZUTSUMI TOSHIHIKO
KOZUTSUMI TOSHIHIKO
Application Number:
JP14545091A
Publication Date:
December 11, 1996
Filing Date:
May 21, 1991
Export Citation:
Assignee:
SHOWA HIGHPOLYMER
International Classes:
C09D163/00; C08G59/00; C08G59/14; C08L63/00; C09D5/00; (IPC1-7): C09D163/00; C08G59/14; C08L63/00; C09D5/00; C09D163/00
Domestic Patent References:
| JP4180976A |
Attorney, Agent or Firm:
Yaguchi flat