Title:
ARMOR RESIN AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH10335102
Kind Code:
A
Abstract:
To provide a water-resistant, washable armor resin and an electronic component exploiting the same capable of maintaining high mechanical strength, low cost, low internal stress, and good drying.
This armor resin consists of a first layer 6 and a second layer 7 and is structured in double layers. The first layer 6 has its open hole volume V(1)(cc/g) in 0.08≤V(1)≤0.13 and its distribution of open hole diameter Rp10%(1)(μm) in 2.40≤RP10%(1)≤3.50. The second layer 7 has its open hole volume V(2)(cc/g) in 0.05≤V(2)≤0.10 and its distribution of open hole diameter Rp10% (2)(μm) in 0.35 ≤Rp10%(2)≤0.90.
Inventors:
KATSUBE HIROSHI
KAWAKAMI AKIHIKO
NISHIMOTO KOJI
SUMIDA MANABU
OSHIRO MUNEYUKI
KAWAKAMI AKIHIKO
NISHIMOTO KOJI
SUMIDA MANABU
OSHIRO MUNEYUKI
Application Number:
JP13664197A
Publication Date:
December 18, 1998
Filing Date:
May 27, 1997
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
B32B5/18; B32B27/38; C09D163/00; H01C1/034; H01L23/29; H01L23/31; H03H9/17; (IPC1-7): H01C1/034; B32B5/18; B32B27/38; C09D163/00; H01L23/29; H01L23/31; H03H9/17
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