Title:
芳香族オリゴマー、それを配合したフェノール樹脂組成物並びにエポキシ樹脂組成物およびその硬化物
Document Type and Number:
Japanese Patent JP4651774
Kind Code:
B2
Abstract:
This invention relates to an aromatic oligomer which is useful as a modifier of epoxy resin compositions, to a phenolic resin composition comprising said aromatic oligomer and to an epoxy resin composition comprising said aromatic oligomer and is useful for encapsulating electric and electronic parts and as a circuit board material. The aromatic oligomer of this invention is obtained by polymerizing monomers mainly consisting of aromatic olefins comprising 20 wt % or more of acenaphthylenes and shows a softening point of 80-250° C. The phenolic resin composition or epoxy resin composition of this invention is obtained by incorporating 3-200 parts by weight of the aromatic oligomer per 100 parts by weight of phenolic resin or epoxy resin. The cured epoxy resin of this invention is obtained by curing the epoxy resin composition.
More Like This:
Inventors:
Masashi Kaji
Kiyokazu Yonekura
Kiyokazu Yonekura
Application Number:
JP2000109271A
Publication Date:
March 16, 2011
Filing Date:
April 11, 2000
Export Citation:
Assignee:
Nippon Steel Chemical Co., Ltd.
International Classes:
C08L45/00; C08F2/44; C08L61/06; C08F32/08; C08F283/00; C08G59/40; C08L63/00; H01L23/14; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
| JP11343386A | ||||
| JP11302360A | ||||
| JP3100005A | ||||
| JP3166204A | ||||
| JP4300906A | ||||
| JP11029694A | ||||
| JP2001192539A | ||||
| JP2001019725A |
Foreign References:
| US4418187 | ||||
| GB1362046A |
Attorney, Agent or Firm:
Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano
Tomohiro Nakamura
Eiichi Sano