PURPOSE: To dispense with a process for cutting piezoelectric ceramics, by laminating a large number of thin plates composed of piezoelectric ceramics by an insulating adhesive and slicing said thin plates in the direction perpendicular to the surfaces of said thin plates.
CONSTITUTION: Thin plates 2 composed of unpolarized piezoelectric ceramics are laminated by an insulating adhesive 3 to form square pillar-shaped laminated ceramics 1. Next, the laminated ceramics 1 is sliced in the direction vertical to the surfaces of the thin plates 2 to obtain a ceramic flat plate 4. After the ceramic flat plate 4 is processed so as to have a dimension necessary for an array probe, electrodes 5 are formed to the ceramic flat plate 4 by the printing, vapor deposition or sputtering of a silver paste and only the single side electrode 5 is divided by etching. Then, polarizing treatment is performed and a lead is taken from each vibrator to be adhered to a backing material. By this method, the cutting of the piezoelectric ceramics becomes unnecessary and the miniaturization of the array vibrator becomes easy.
SUZUKI SHUJI
SAITO SHIRO
Next Patent: RUNNING BODY FOR FLAW DETECTION AND INSPECTION OF TANK EQUIPPED WITH WALL SURFACE FIXING AUXILIARY J...