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Title:
無菌充填方法及び無菌充填機
Document Type and Number:
Japanese Patent JP6973693
Kind Code:
B2
Abstract:
Even when the filling rate is high, the surface temperature of molded bottles is kept at a certain temperature or higher, and the bottles can be adequately sterilized with a sterilizer.A preform is heated, the heated preform is sealed in a neck portion mold, a trunk portion mold and a bottom portion mold at a predetermined temperature range, and the preform sealed in the molds is blow-molded into a bottle. Any bottle is removed which has been molded in the neck portion mold, the trunk portion mold and the bottom portion mold the temperature of any of which is outside the predetermined temperature range, and a sterilizer is blasted to any bottle for sterilization which has been molded in the neck portion mold, the trunk portion mold and the bottom portion mold the temperature of all of which is in the predetermined temperature range.

Inventors:
Mutsumi Hayakawa
Yoshinori Sato
Application Number:
JP2021532971A
Publication Date:
December 01, 2021
Filing Date:
November 10, 2020
Export Citation:
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Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B65B55/10; B65B55/04
Domestic Patent References:
JP2018177263A
Attorney, Agent or Firm:
Patent Business Corporation Intect International Patent Office
Yoshinori Ishibashi