無菌充填方法及び装置 - Dai Nippon Printing Co.,Ltd.

Title:

無菌充填方法及び装置

Document Type and Number:

Japanese Patent JP5804164

Kind Code:

B2

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Inventors:

Mutsumi Hayakawa
Takuma Miyawaki

Application Number:

JP2014179960A

Publication Date:

November 04, 2015

Filing Date:

September 04, 2014

Export Citation:

Assignee:

Dai Nippon Printing Co.,Ltd.

International Classes:

B29C49/42; B29C49/06; B65B55/04; B65B55/10; B67C3/02

Domestic Patent References:

Foreign References:

WO2006136499A1

Attorney, Agent or Firm:

Patent Business Corporation Intect International Patent Office
Kazuyuki Oku

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